Packaging of High Power Semiconductor

¥11375

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商品の説明

Packaging of High Power Semiconductor Lasers

(Micro- and Opto-Electronic Materials, Structures, and Systems) (English Edition)

This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.

ISBN-13: 978-1461492627

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商品の情報

カテゴリー本・音楽・ゲーム > 本 > 参考書
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Advanced power electronics packaging - Power Electronic Tips


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Packaging of High Power Semiconductor Lasers


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Power Packaging | High Density Electronics Center


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It's Time to Rethink Power Semiconductor Packaging


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Power Electronics Packaging and Assembly | Indium Corporation


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Increasing The Conductive Density Of Packaging


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Power Electronics Packaging | Transportation and Mobility Research


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High temperature power electronic module packaging | Semantic Scholar


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Advanced power electronics packaging - Power Electronic Tips


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Power electronics packaging concepts: (a) the planar structure


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Trends in automotive power semiconductor packaging - ScienceDirect


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Power Electronics Packaging | Transportation and Mobility Research


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Advanced power electronics packaging - Power Electronic Tips


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Figure 1 from Survey on High-Temperature Packaging Materials for


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Frontiers | Review of Issues and Solutions in High-Power


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Six Reasons to Rethink Power Semiconductor Packaging


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Trends in automotive power semiconductor packaging - ScienceDirect


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Powerful Knowledge 11 - Packaging of power semiconductors


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Trends in Power Electronics Packaging


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Power Device Package Designs - Power Electronics News


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Technology Trends & Challenges in Power Semiconductor Packaging


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Energies | Free Full-Text | High Performance Silicon Carbide Power


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Packaging - Aalborg University


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Packaging Advances High-Power White LEDs | Features | Aug 2005


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Yole Group - Follow the latest trend news in the Semiconductor


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Infineon QDPAK and DDPAK registered as JEDEC standard - News


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PDF) Review of Packaging Schemes for Power Module


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Advanced Semiconductor Packaging 2023-2033: IDTechEx







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Packaging of High Power Semiconductor

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